Systems

MPPS (Micro Parts Picking System)

MPPS (Micro Parts Picking System)

Automatic micro-part picking system combining an ultrasonic motor gripper with image processing technology. Solves three key challenges — sticking, misalignment, and invisibility — to transport ultra-small, lightweight, and irregular-shaped parts with high precision. Two cameras mounted directly above the finger provide simultaneous real-time monitoring and image recognition. Ideal for high-mix low-volume production and precision assembly.

Vibration-free, heat-free picking (ultrasonic motor gripper)Dual cameras above the finger — one for monitoring, one for image recognitionPart identification by image recognition (shape, orientation, front/back)Micro-part adhesion removal function
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Laser Beam Rotator (For Laser Micromachining)

Laser Beam Rotator (For Laser Micromachining)

Beam rotator for laser micromachining. Optical elements integrated into a hollow motor enable coaxial beam diameter adjustment. Coaxial measurement capability integrates processing and measurement. Electrical phase shifting allows diameter changes while the motor continues rotating.

Coaxial beam rotator for laser micromachiningCoaxial measurement capability — integrates processing and measurementMulti-axis synchronized control with optical elements in hollow motorSimple structure without mechanical adjustment enables large-diameter (Φ40) high-speed rotation
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3D Robot Vision Camera

3D Robot Vision Camera

Laser-based method keeps the entire deep area in focus for stable measurement. Green laser (520nm) enables depth-of-field measurement impossible with white light methods. Wide-area scanning through combination of 2D scanner and actuator.

Stable 3D measurement with laser methodDepth-of-field measurement with green laser (520nm)Wide-range scan with 2D scanner + actuatorCompact design for robot hands
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Laser Displacement Sensor

Laser Displacement Sensor

Laser displacement sensor that can be installed coaxially with the laser axis of welders, processing machines, and markers. Achieves 15mm offset between emission laser and receiving axis, compatible with small-diameter galvano mirrors. Compact design for easy equipment integration.

Coaxial integration15mm axis offset for small mirrorsMeasurement distance 300-1000mmUSB 3.0 interface
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